Mold | HITS | ㈜에이치아이티에스

Products

Mold

반도체 패키지 Mold의 외관 및 측면 두께·표면 검사

Mold Inspection System

System that inspects the external appearance of Mold

Features

  • Applicable to FCBGA Substrate
  • Provide various statistical data by NG type
  • Flying High Speed Inspection
  • View function to observe and measure precisely (Detail observation up to 1 Pixel)
  • Accuracy : Over 20um
  • Inspection Item : Pin-Hole, Incomplete, S/C, Exposure, FM, etc.
Composition
M/Z Loading, Transfer Rail, Vision Inspection, M/Z Unloading

Mold Side Thickness & Surface Inspection System

System that inspects the lateral appearance of Semiconductor PKG Mold

Features

  • Provide various statistical data by NG type
  • PKG Alignment by Align Vision (Resolution : 26um/pixel)
  • Inspection Resolution : 2um
  • Accuracy : 5um
  • Inspection Item : Thickness, Crack, Void by 3-point measurement
Composition
Tray Loading, PKG PnP, Alignment Vision Inspection, Vision Inspection, Tray Unloading