塑封检测 | HITS 视觉检测

Products

塑封检测

用于半导体封装塑封体的外观、侧面厚度和表面检测。

Mold Inspection System

System that inspects the external appearance of Mold

核心功能

  • Applicable to FCBGA Substrate
  • Provide various statistical data by NG type
  • Flying High Speed Inspection
  • View function to observe and measure precisely (Detail observation up to 1 Pixel)
  • Accuracy : Over 20um
  • Inspection Item : Pin-Hole, Incomplete, S/C, Exposure, FM, etc.
系统构成
M/Z Loading, Transfer Rail, Vision Inspection, M/Z Unloading

Mold Side Thickness & Surface Inspection System

System that inspects the lateral appearance of Semiconductor PKG Mold

核心功能

  • Provide various statistical data by NG type
  • PKG Alignment by Align Vision (Resolution : 26um/pixel)
  • Inspection Resolution : 2um
  • Accuracy : 5um
  • Inspection Item : Thickness, Crack, Void by 3-point measurement
系统构成
Tray Loading, PKG PnP, Alignment Vision Inspection, Vision Inspection, Tray Unloading