Wafer Inspection | HITS | ㈜에이치아이티에스

Products

Wafer Inspection

Sawing 라인 웨이퍼 불량 검사와 CD·오버레이 계측을 아우르는 검사 시스템

Wafer UV Inspection System

UV vision inspection system for the sawing line. It handles wafer rings automatically and screens sawn wafers for defects, mapping every NG die and presenting it for operator review.

Features

  • Automated rail, buffer and gripper handling for wafer-ring loading and unloading
  • Stage X/Y, vision Z and vacuum control for stable inspection positioning
  • UV vision inspection of sawn wafers with defect mapping and operator review
  • Integrated expander and marking-unit interlocks
  • Recipe-based device control with HMI status monitoring
Composition
Loading Rail, Buffer, Gripper, Wafer Ring Guide, Stage X/Y, Expander, Vacuum Table, Vision Z, UV Vision, Marking Unit, Mapping & Review, Unloading Rail

Wafer CD & Overlay Inspection System

Wafer inspection system that measures critical-dimension size and overlay alignment and screens defects, with a wafer map and review station for verifying results.

Features

  • CD (Critical Dimension) size measurement
  • Overlay alignment measurement
  • Defect inspection and classification
  • Wafer mapping with an operator review station
  • Dual inspection stations with independent optics and displays