IR Crack Inspection System
System that inspects a crack, chipping, etc. on pattern side of Flip chip and provides mapping on detected NG by NIR / SWIR camera
Key Features
- Applicable to 74, 95mm FCBGA Substrate, FCCSP, FCSiP
- Customized by Substrate, JIG, Boat
- Customized by NIR or SWIR camera
- Application of Deep Learning Algorithm to reduce overkill
- Mapping & Review Function for verification on detected NG
- System Configuration
- M/Z Loading, Barcode Scan, Guide Rail, Transfer, Vacuum Table, Vision Inspection, M/Z Unloading