Products
Vision Inspection System
Inspection systems that use advanced imaging and machine intelligence to protect quality and yield.
Vision Inspection System Lineup
Inspection systems that use advanced imaging and machine intelligence to protect quality and yield.
Wafer Inspection
Automated wafer-ring positioning, UV vision inspection, NG mapping and review.
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Package Inspection
Marking, mold and ball-land inspection for ultra-thin packages after marking.
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IR Crack
NIR/SWIR imaging detects cracks and chipping on flip-chip pattern surfaces.
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W/B, D/A
2D/3D appearance and loop inspection for wire-bonding and die-attach processes.
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Mold
External appearance, side-thickness and surface inspection for semiconductor-package molds.
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Secondary Cell Battery
Cutting-edge and bus-bar welding/appearance inspection for secondary batteries.
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