Products
Overview
Inspection and automation systems for semiconductor and secondary-battery production lines.
Systems engineered around your process.
Wafer Inspection
Automated wafer-ring positioning, UV vision inspection, NG mapping and review.
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Package Inspection
Marking, mold and ball-land inspection for ultra-thin packages after marking.
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IR Crack
NIR/SWIR imaging detects cracks and chipping on flip-chip pattern surfaces.
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W/B, D/A
2D/3D appearance and loop inspection for wire-bonding and die-attach processes.
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Mold
External appearance, side-thickness and surface inspection for semiconductor-package molds.
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Secondary Cell Battery
Cutting-edge and bus-bar welding/appearance inspection for secondary batteries.
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Auto Loader / Unloader
Automatic substrate and jig loading and unloading for flip-chip bonding and SMT processes.
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Assembly Tester
Handler systems that sort and transfer modules after electrical-characteristic testing.
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Protective Band Taping
Protective-band ESD tape application for devices carried in reels.
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Jig Auto Cleaning System
Chemical-free automated cleaning for metal jigs using DI water and high-temperature, high-pressure steam.
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Wafer Sorter System
Bidirectional wafer ID reading, alignment, sorting and transfer between Jar Boxes, FOSBs and cassettes.
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Wafer Auto Bake System
Automated wafer loading, high-temperature baking and unloading with a wafer transfer robot.
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Inline Tray Auto Packing System
Fully automated inline packing from tray split through finished box packing.
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Inline Reel Auto Packing System
Fully automated reel labeling, vacuum packing and box shipment preparation.
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Inline Module Auto Packing System
Inline module packing line whose vision stage detects and sorts operator errors before shipment.
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