IR Crack Inspection System
通过 NIR/SWIR 成像检测倒装芯片图案表面的裂纹和崩边。
核心功能
- Applicable to 74, 95mm FCBGA Substrate, FCCSP, FCSiP
- Customized by Substrate, JIG, Boat
- Customized by NIR or SWIR camera
- Application of Deep Learning Algorithm to reduce overkill
- Mapping & Review Function for verification on detected NG
- 系统构成
- M/Z Loading, Barcode Scan, Guide Rail, Transfer, Vacuum Table, Vision Inspection, M/Z Unloading