Inline Module Auto Packing System
在模块包装流程中自动识别并分拣人为失误的在线自动包装系统。
核心功能
- Applicable to Semiconductor Module
- OCV Vision Inspection on Tray Cap Label
- Direct 1D / 2D Barcode Scan on module in tray
- Separation & Assembly Function on Tray & Cap
- Desiccant & Pink Foam Insertion Function with position check by Vision
- 系统构成
- Module Tray Loading, Module Tray Loading Buffer, OCV Vision, Separation PnP, Human Error Inspection, Reject Port, Desiccant/Pink Foam Insertion, Assembly PnP, Module Tray Unloading Buffer, Module Tray Unloading
