引线键合 / 芯片贴装

核心功能

• Applicable to FCBGA Substrate
• Deep Learning Algorithm, Review Function for verification
• 29M High Resolution camera
• Accuracy : 1.8um
• Provide various statistical data by NG type
• Inspection : Wire connecting status, Stitch, Ball Attachment Status

系统构成

Magazine Loading/Unloading, Buffer Rail, Gripper PnP, Vibration free super precision state, Porous Chuck Table, 3D Vision Inspection

核心功能

• Possible to measure loop of stack device
• Measurement Repeatability : ±1um
• Excellent Expandability on Measurement Area
• Dual Vision Inspection Lane for 2D & 3D
• Deep Learning Algorithm, Review Function for verification
• 2D W/B : Ball Lifted, Size, Placement, Off center, Broken wire, wire to wire distance, etc.
• 2D D/A : Chip crack, Die position (No die, Die O/T), Pad Abnormal (Probe Mark), Film Shift, Common, Sub Defect, Die Scratch
• 3D : Loop & Edge Height, Sub Height, Die Height

系统构成

Magazine Loading/Unloading, Buffer Rail, Gripper PnP, Dual Vibration free super precision state, Porous Chuck Table, 2D Vision Inspection, 3D Vision Inspection

核心功能

• Applicable to FCBGA Substrate
• Deep Learning Algorithm, Review Function for verification
• 29M High Resolution camera
• Accuracy : 1.8um
• Provide various statistical data by NG type
• Inspection : Wire connecting status, Stitch, Ball Attachment Status

系统构成

Magazine Loading/Unloading, Buffer Rail, Gripper PnP, Vibration free super precision state, Porous Chuck Table, 3D Vision Inspection