Wafer Auto Bake System
利用晶圆搬运机器人自动完成晶圆上料、高温烘烤和下料。
核心功能
- Dimension: 3,200(W) x 2,400(D) x 2,100(H)mm
- Process: Wafer Bake
- Wafer Thickness: ~1mm @ 12"
- Temp. Range: 30 ~ 350℃
- Temp. Uniformity: 30~100℃ ±2℃ / 101~200℃ ±3℃ / 201~300℃ ±4℃
- Temp. Calibration: 6-point calibration (Auto / Manual)
- Loader Port: Dual FOUP / FOSB Manual Cassette
- Oven: 4-Chamber (optional), Chiller external type, 24 Slot / Chamber
- Buffer: 100 Slot, Front door Auto / Rear door Manual
- Wafer Transfer: WTR w/ Dual End Effector
- Temp. Up/Down Time: 60min / 90min
- Exhaust Air Temp.: below 50℃
- Host Communication: SECS-GEM
- Material Handling: OHT or AGV (option)
- 系统构成
- FOUP/Cassette Loading Port, WTR (Wafer Transfer Robot), Bake Oven Chamber, Buffer Unit, Wafer Unloading