FCBGA Precision Auto Loading System
At Flip Chip Bonding Process, System that load Substrate or Assembled Bottom JIG / Substrate / Top JIG to Bonder
核心功能
- Applicable to 74, 95mm Substrate by auto conversion & conversion kit
- Customized by Single or Dual Lane
- Substrate Quality Check by QC Vision with Automatic Map Function
- Applicable to OHT for Material Handling System
- 系统构成
- BTM JIG Magazine Loader/Unloader, Transfer/Working Rail, Substrate Bundle, Top JIG Bundle, PnP, Alignment Vision
