PKG Inspection System
针对超薄封装在打标后的字符、塑封和焊球区域进行检测。
核心功能
- Applicable to FCBGA Substrate
- Inspection on the front and back side surface of substrate
- Accuracy : 10um
- Mold : Chip out, Incomplete mold, Void hole, Bubble, Porosity, Crack Sticking, Scratch
- Marking : Illegible Mark, Double Mark, Incorrect orientation, Wrong Mark, Misplace Mark, No Mark
- Ball Land : Cu Exposure, Scratch, Contamination, Foreign Material, Sub Broken/Pressed
- 系统构成
- M/Z Loading, Transfer Rail, Top Vision Inspection, Btm Vision Inspection, M/Z Unloading